A PCB assembly line consists of 3 operations: Screen the boards, Place the components and solder the components in an oven. Each operation is described as follows (all operations are presumed done with Operation average = PROCESS Nominal, and the process is 2-sided distribution. Screen: Quality measured by the height of the material deposited, through a control chart Nominal __10 _mils__USL_12No lower limit provided Control Chart : R bar 4_ LCLR 0 _Sample Size 4 Reject Rate ______%, _PPM, Yield ___% Cp , Cpk_ Place: Quality measured by the defect rate obtained, using nP chart, assume process centered and two-sided specification limit Reject rate 1 in 4,000 PPM, Yield ___% Cp , Cpk_ Oven Quality measured by # solder shorts in 10,000 parts, using C chart, assume process centered and twosided specification limit Nominal _2 short/1,000 parts C chart : Cbar_ UCLc _ LCLc _ Reject Rate ____%, _PPM, Yield ___% Cp , Cpk_ Total Process: Quality measured by all defects in the line of three machines, assume process centered and two sided specification limit Reject Rate ____%, _PPM, Yield _% Cp , Cpk___

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