1) Give a process flowchart on SEMICONDUCTORS MANUFACTURING.

2. Describe each Process.

 

This are the step by step of Semiconductor flow chart in order to manufacture their product.

1st step - Prepare Silicon wafer

2nd step -Projected Light and Patterns are projected repeatedly onto wafer

3rd step - Exposed photoresist is removed

4th step - Areas unprotected by photoresist are etched gases

5th step - Ions shower the etched areas, Doping them. New photoresist is spun on wafer, and repeat steps 2 to 4.

6th step - Similar cycle is repeated to lay down metal links between transistors.

Step-by-step explanation

Semiconductor manufacturing flow chart explanation step by step.

1. A silicon wafer has been prepared from an ingot by cutting and polishing. The wafer then has layers of material applied. These include a silicon oxide layer, a silicon nitride layer and a layer of photoresist.
2. A light is then projected through a reticle and a lens unto the wafer surface. This pattern is projected numerous times onto the wafer for each chip.
3. The photoresist that was exposed to the light can now be chemically removed.
4. The areas where the photoresist has been removed can now be etched, which in the case above, is done by gases.
5. An ionic gaseous stream showers the chip and "dopes" those regions that were exposed due to etching. New photoresist can be applied to the wafer and steps 2-4 are repeated.
6. In a similar repeated cycle, metal links can be laid down between transistors.Every step of the process requires elastomer seals to isolate the process from the outside atmosphere. The processing environment is very aggressive and often requires high performance perfluoroelastomer (FFKM) seals for longer service life.