question archive (USCS units) A 12?in wafer is processed over a circular area of diameter = 11
(USCS units) A 12?in wafer is processed over a circular area of diameter = 11
Subject:Mechanical EngineeringPrice: Bought3
(USCS units) A 12?in wafer is processed over a circular area of diameter = 11.875 in. From previous experience, the density of point defects in the surface area is 0.010 defects/in2. The chips to be fabricated are square with an area of 0.49 in2 each. Determine an estimate of the number of good chips using the Bose?Einstein yield computation.
